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New Flexible, Low Viscosity Potting Compound

Master Bond, Inc. Press Release - 2/13/2008

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New potting compound suitable for electronics circuitry protection

Potting Compound has flexible, low-viscosity formulation

Potting Compound has flexible, low-viscosity formulation

HACKENSACK, N.J. - A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.

Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.

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Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.

About Master Bond:

Master Bond is a manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. The product line offers over 3,000 grades of specially designed formulations of acrylics, anaerobics, cyanoacrylates, epoxies, latex, polyamides, polyurethanes and silicone systems to provide an optimal solution for even the most extreme applications.

For further information please visit our website at