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Bridgelux Announces U.S. Patent Award
for Surface Mountable Led Chip

Company Continues to Strengthen its IP Portfolio

Bridgelux Press Release

FlashlightNews.org - 1/28/2009
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Bridgelux

Bridgelux

SUNNYVALE, Ca. - Bridgelux, Inc., a leading supplier of energy-saving light-emitting diode (LED) technology for high-volume, solid-state lighting markets, today announced the award of a U.S. patent for its surface mountable chip (SMC) LED design. This SMC architecture fundamentally changes how LEDs will be deployed by eliminating the need for traditional LED packaging.

The innovative chip design offers a high flux density LED with an ultra small footprint and thin profile, with the ability to closely pack multiple chips together for increased performance in space limited applications such as camera flash, LCD display backlighting and general or specialty lighting applications. The design of this chip also delivers a surface mountable "thin-film" architecture, providing a flat surface for direct deposition of a phosphor layer on the LED die.

Since the founding of Bridgelux, the Company has invested in the development of its IP portfolio relating to MOCVD reactor design, leading-edge epi technologies, advanced LED chip design, manufacturing processes and innovative packaging techniques. To accomplish this, Bridgelux has assembled a world-class team of seasoned technologists, expert in the LED and solid-state lighting (SSL) industries.

"This new patent award demonstrates Bridgelux's focus on driving innovation in core technologies to improve performance and reduce the cost of our lighting technologies," noted Bridgelux's director of R&D, Steve Lester. "The company is aggressively adding to its intellectual property (IP) portfolio. Bridgelux, currently, has over 75 patents filed in the U.S. and over 130 patent applications filed worldwide. Bridgelux's investments in MOCVD and chip design enable the Company to continue to innovate and deliver the right quality and quantity of light for specific SSL applications."

The Bridgelux SMC LED design will enable manufacturers to bond the chip directly onto the printed circuit board (PCB), eliminating the need for an additional substrate or traditional LED package. This is the first discrete, thin-film device with two bottom contacts and a flat surface on which a phosphor can be applied. Direct deposition of phosphor film at either the wafer or package level can achieve a quality of white color consistency that no other commercially available LED die platform can currently offer. Bridgelux intends to manufacture LED chips using its SMC design at the Company's state-of-the-art manufacturing facility in Sunnyvale, Calif., or where appropriate, through one of its manufacturing partners.

With this innovative chip design, non-value add components or manufacturing processes can be eliminated, gaining the ability to enhance system integration and reduce the cost of the total lighting solution. This chip will deliver greater manufacturing flexibility for high flux applications requiring multiple emitters, enable higher flux density for etandue limited applications, and allow for individual chip addressability via the board to which multiple SMCs are attached.

About Bridgelux

Focused on bringing innovation to light, Bridgelux is a leading provider of high-power, cost-effective and energy-efficient light-emitting diode (LED) solutions. The company's proprietary epitaxy technology, innovative chip designs and leading-edge LED packaging technology have enabled the company to develop advanced solid-state lighting (SSL) products that offer superior quality, are lower in cost and environmentally friendly - all without compromising performance. In addition to LED chips, the company delivers a range of SSL light sources enabling OEM customers to easily integrate into a variety of lighting applications that will open up new markets in solid-state lighting. Founded in 2002, Bridgelux is headquartered in Sunnyvale, Calif.

For more information about the company, please visit bridgelux.com.

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