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Thermal Gel Offers Heat Protection for
High-Performance Semiconductors

New Soft Paste-Type Thermal Gel from AAC Features Excellent Thermal Conductivity for Electronic Component Applications

Advanced Antivibration Components Press Release - 6/23/2009

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Thermal Gel

V30Z63MDP Series Thermal Gel from Advanced Antivibration Components

NEW HYDE PARK, N.Y. - New soft paste-type thermal gel from Advanced Antivibration Components - AAC features excellent thermal conductivity up to 6.5W/m o K. This RoHS controlled substance is used to fill gaps around heat sources such as high-performance semiconductors. Other applications involve surface, underside, and lead heat sources such as IC's.

The paste is most popular for use where it is difficult to fix sheet-type thermal gel. These applications include: computer internal components, power supplies, power transistors, and other heat producing components.

There are 3 types of gels, identified as the V30Z63MDP... Series, which come in a syringe to make for easier application of the gel. High specific volume resistance ratio up to 7.2x1014 W o cm. Low dissipation factor down to 0.0004 at 1MHz. High breakdown voltage up to 9.6 kv/mm. They contain nothing harmful and are therefore considered environment-friendly. At the AAC eStore you can check price and availability, place an online order, download 3-D models, or request a quote at anytime.

Additional technical specifications are contained in Catalog V110 available free upon request from Advanced Antivibration Components - AAC, 2101 Jericho Turnpike, Box 5416, New Hyde Park, New York 11042-5416. Phone: 516-328-3662. Fax: 516-328-3365 Web:

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